Inslogic unveils advanced materials for functional 3D printing applications at industry event.
Inslogic introduced its reinforced, functional 3D printing materials at RAPID + TCT 2025, showcasing solutions for functional prototyping, end-use production, and demanding mechanical environments.
The company showed a set of advanced materials that offer improved mechanical properties for more complex applications. The range covers thermoplastic filaments and photopolymer resins.
“This year’s RAPID + TCT has been an unforgettable experience,” said an Inslogic representative. “Inslogic is excited to continue its commitment to supporting the 3D printing community with quality, high-performance, reliable materials produced for real-world applications.”
The filaments showcased included PEEK, which is highly strong and resistant to heat and chemicals, and PA12-CF, a carbon-fiber-reinforced nylon that offers optimal strength but is lower density and ideal for lightweight printing. Additional filaments included PA6-CF with high heat resistance (up to 209°C), PC-ABS (a blend of polycarbonate and ABS), glass fiber-reinforced PA6-GF25, and flame-retardant ABS FR V0, TPU 90A elastomer.
The resin offerings featured high temperature variants capable of withstanding up to 300°C and flexible 70A resin with enhanced resistance to bending and compression.
Inslogic also displayed a 3D printed puzzle cube at its booth, demonstrating the precision and durability of its materials.
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The new materials are expected to support broader adoption of additive manufacturing across industrial applications.
